Today, I will share technical details and design strategies related to DARPA's defense Microelectronics through summary visuals. Link for those who want to examine the topic in more detail
DARPA's microelectronic design process
DARPA's current microelectronic designs and general values
Here is a more detailed version of the existing hybrid designs
Performance and price/performance values of existing designs
The modular chip design is said to support high-speed data transfer
FPGA interfaces that Intel is working on in DARPA's heterogeneous modular designs
Microelectronic design strategy and scaling of design architectures targeted by DARPA in the future
5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; Wafer-Level Packaging; Materials & Emerging Research Materials; Internet of Things (IoT)
ieeetv.ieee.org
Trends in test technologies for any technology you can think of (electronic circuit elements, sensors, 5G technologies)
Summary assessments of emerging trends in microelectronic technologies
- Use of graphene and 2-dimensional materials in microelectronics
- Future of printable electronics with layered fabrication
and I roughly shared other topic titles.
SiP and Module System Integration
Chip/Package/Board Co-Design Methodology Applied to Full-Custom Heterogeneous Integration
app.blackhole.run
DARPA's microelectronic design process
DARPA's current microelectronic designs and general values
Here is a more detailed version of the existing hybrid designs
Performance and price/performance values of existing designs
The modular chip design is said to support high-speed data transfer
FPGA interfaces that Intel is working on in DARPA's heterogeneous modular designs
Microelectronic design strategy and scaling of design architectures targeted by DARPA in the future
5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; Wafer-Level Packaging; Materials & Emerging Research Materials; Internet of Things (IoT)
Working Group Meeting 3: 2021 IEEE Heterogeneous Integration Roadmap
Presentation from the 2021 IEEE Heterogeneous Integration Roadmap Symposium, with talks/discussion on 5G, RF and Analog Mixed Signal; Mobile; Aerospace & Defense; Wafer-Level Packaging; Materials & Emerging Research Materials; Internet of Things (IoT).
Trends in test technologies for any technology you can think of (electronic circuit elements, sensors, 5G technologies)
Summary assessments of emerging trends in microelectronic technologies
- Use of graphene and 2-dimensional materials in microelectronics
- Future of printable electronics with layered fabrication
and I roughly shared other topic titles.
SiP and Module System Integration
Chip/Package/Board Co-Design Methodology Applied to Full-Custom Heterogeneous Integration
1 file shared with you
This file shared with BlackHole. Send any file using blockchain technology.
app.blackhole.run
Last edited:
