India's semiconductor push gets major boost with $3.3 bn Odisha deal with Intel & 3D Glass Solutions
"...India’s semiconductor ambitions got a fresh boost with the signing of a tripartite memorandum of understanding between the
Odisha government, Intel Corporation and US-based
3D Glass Solutions Inc. (3DGS) on May 29 to establish an advanced packaging glass core substrate manufacturing facility in the state. The proposed project, to be located in the Bhubaneswar-Khurda region, entails an estimated investment of about
$3.3 billion, making it among the country’s largest investments in high-technology manufacturing.
Officials said
the facility would manufacture advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor components, with Intel expected to provide technology expertise and process support. Industry executives said advanced packaging technologies are becoming increasingly critical as chipmakers seek higher performance and energy efficiency.
Glass core substrates are seen as a next-generation technology for semiconductor packaging due to their superior thermal and electrical properties compared with conventional organic substrates..."
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Odisha, Intel and 3D Glass Solutions Inc. signed an agreement for a new advanced packaging glass core substrate manufacturing facility. This project, with an investment of $3.3 billion, will be located in the Bhubaneswar-Khurda region. The facility will produce advanced semiconductor components.
m.economictimes.com
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This is cutting-edge stuff. Here's a primer on Intel's glass core packaging technology:
Basically, it's been in R&D for over a decade at this point, and the plan is to bring this technology to the mass market by around 2030. It appears India will be at least one of the manufacturing centres where these next-gen substrates will be made & exported from.
