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NEW DELHI, Sept 6 (Reuters) - Israel's Tower Semiconductor (TSEM.TA) and Adani Group will invest 839.47 billion rupees ($10 billion) for a semiconductor project in India's western state of Maharashtra, its chief minister said in a post on X on Thursday.

India has taken steps to encourage global companies to set up their manufacturing units in the country, with Prime Minister Narendra Modi aiming to make the country a chipmaker for the world despite initial setbacks.

Foxconn withdrew in July last year from a $19.5 billion semiconductor joint venture with Indian conglomerate Vedanta, and plans by ISMC, a venture between Abu Dhabi-based Next Orbit Ventures and Tower Semiconductor, to invest $3 billion in India, have been stalled.

Still, India expects its semiconductor market to be worth $63 billion by 2026.

Semiconductor manufacturing marks the latest foray for billionaire Gautam Adani, whose conglomerate has businesses across ports, power utilities, transmission and coal trading.

The $10 billion semiconductor plant in Maharashtra will initially have a capacity of 40,000 wafers, the state's deputy chief minister Devendra Fadnavis said in a post on X.

Chief Minister Ehnath Shinde said in a social media post that projects worth 1.17 trillion rupees were approved on Thursday, which will create 29,000 jobs in the state.

Two new electric vehicle manufacturing units will also be set up in the state, with Skoda-Volkswagen investing 150 billion rupees for its plant to produce electric vehicles and hybrids.

Toyota-Kirloskar will dole out 212.73 billion-rupees to manufacture hybrid and electric vehicles at its plant in the state.

Adani group, Tower Semiconductor, Skoda-Volkswagen (VOWG_p.DE) and Toyota-Kirloskar (7203.T), did not immediately respond to a request for comment from Reuters.
 

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Any information on the US proposed FAB in India discussed and agreed during Modi’s visit to,US and meeting Biden.
 

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Any information on the US proposed FAB in India discussed and agreed during Modi’s visit to,US and meeting Biden.

 

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Deputy Editor Snehesh Alex Philip speaks to Udayant Malhoutra, CEO & Managing Director of Dynamatic Technologies Limited, on the journey from being a manufacturer of hydraulic pumps for tractors to making parts for world’s top aviation firms

 

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India ranks third globally in chip design research papers

Authors from Indian organisations contributed 39,709 papers, which was 8.4% of the global share of 472,819 research papers during the period. India's contribution grew 26% in the five-year period, in line with the country's emerging focus on the critical industry.

 

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UPI’s growth pangs, Japan eyes Indian chips​



South Korea and Taiwan Follow Japan’s Lead in India’s Semiconductor Push​

 

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Union Minister for Electronics and Information Technology Ashwini Vaishnaw on Tuesday inaugurated India’s first 3-nanometre (3nm) chip design centres in Noida and Bengaluru, marking a key milestone in the country’s push towards advanced semiconductor innovation. The centres have been set up by Renesas Electronics India Private Limited and are poised to place India among a select group of nations working at the cutting edge of chip technology.

Vaishnaw said, “Designing at 3nm is truly next-generation. We’ve done 7nm and 5nm earlier, but this marks a new frontier.” He added that the launch reaffirms India’s growing presence in the global semiconductor space and reflects increasing industry confidence, witnessed at global platforms such as the World Economic Forum in Davos.

The new centres are part of a broader strategy by the government to build a robust semiconductor ecosystem, spanning design, fabrication, ATMP (Assembly, Testing, Marking, and Packaging), and the supply of associated equipment, chemicals, and gases. The government has also been focusing on nurturing a skilled workforce to meet the growing demand in the semiconductor industry.

Vaishnaw also announced the launch of a new semiconductor learning kit designed to strengthen practical hardware skills among engineering students. Over 270 academic institutions, which have already received access to advanced EDA (Electronic Design Automation) software tools through the India Semiconductor Mission, will also receive these hands-on kits. “This integration of software and hardware learning will create truly industry-ready engineers. We are not just building infrastructure but investing in long-term talent development,” he said, lauding the efforts of CDAC and the ISM team for their efficient execution.

Renesas Electronics CEO and Managing Director Hidetoshi Shibata, who was present at the event, described India as a strategic cornerstone for the company. He said Renesas is expanding its end-to-end semiconductor capabilities in India, from architecture to testing, while actively supporting over 250 academic institutions and a range of startups through government-backed initiatives such as the India Semiconductor Mission and the Production Linked Incentive (PLI) scheme. He also underscored the importance of Indo-Japan collaboration in redefining the global semiconductor lifecycle.
 

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