This is crazy. No one can compete with the Chinese in the market.
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This is crazy. No one can compete with the Chinese in the market.
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But this kind of development will make
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More necessary
I do not think Türkiye will get there anytime soon because cheap labour is very close and people are too greedy to make the necessary investment to reach new heights.
Zafer
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What is even crazier is what happens when Apple iphone gets such a no touch production facility. This gives Xiaomi little advantage as they can tap into low cost workmanship already but gives iphone a huge advantage for production in the US. Imagine all US brands return home for production.
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Is this more cost-efficient than hiring regular people though? Time will tell.
Arçelik and Yongatek has been designing integrated curcuits Since april for Home appliance and small appliances.
www.bloomberght.com
This is great project, I've been expecting/hoping it for some time. After designing military products this is natural step for Yongatek.
Arçelik ve YongaTek'ten yerli çip tasarımı
Sanayi ve Teknoloji Bakanlığının Rekabet Öncesi İşbirliği Destek Programı kapsamında Arçelik ve YongaTek firması işbirliğiyle yerli çip tasarımına başlandı.
www.bloomberght.com
This is great project, I've been expecting/hoping it for some time. After designing military products this is natural step for Yongatek.
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I really really want to be optimistic about HIT 30 project
With the HIT-30 Program we are introducing today, we are directing a total of 30 billion dollars of resources consisting of tax incentives and grant supports to high technology investments. May the HIT-30 Program be beneficial for our country, our nation and our business world. With the program, we will provide qualified support to investments in over 30 topics that will develop semiconductors, mobility, green energy, advanced manufacturing, healthy living, digital technologies, communications, space and value chains in these areas. I would like to emphasize that the 6 calls we announced are the first calls we identified as priorities among our focus areas. In addition to these, we will soon share our calls with the public under 4 more topics: hyperscale data centers, biotechnological drugs, green hydrogen and industrial robotic systems. Comprehensive support will continue to be provided to investment projects under other titles announced in the coming period. I invite all investors to take part in the HIT-30 Program and become a partner in our country's technological breakthrough adventure. I congratulate all institutions that contributed to the preparation of the program.
With the HIT-30 Program we are introducing today, we are directing a total of 30 billion dollars of resources consisting of tax incentives and grant supports to high technology investments. May the HIT-30 Program be beneficial for our country, our nation and our business world. With the program, we will provide qualified support to investments in over 30 topics that will develop semiconductors, mobility, green energy, advanced manufacturing, healthy living, digital technologies, communications, space and value chains in these areas. I would like to emphasize that the 6 calls we announced are the first calls we identified as priorities among our focus areas. In addition to these, we will soon share our calls with the public under 4 more topics: hyperscale data centers, biotechnological drugs, green hydrogen and industrial robotic systems. Comprehensive support will continue to be provided to investment projects under other titles announced in the coming period. I invite all investors to take part in the HIT-30 Program and become a partner in our country's technological breakthrough adventure. I congratulate all institutions that contributed to the preparation of the program.
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22nm is important because it was the first node that was based on tri-gate (FinFET) transistors. Today's cutting-edge nodes still use FinFET transistors. In the near future, GAAFET transistors will replace FinFET transistors.
A facility that produces 22nm FinFET chips can also(theoretically) produce chips as small as 7nm class (TSMC first generation 7nm) with FinFET+DUV combo which can cover current and future "industrial chip" demand of the country. China has a 5nm node but they are exception.
5nm(exception China), 4nm ,3nm node requires EUV tools. 2nm and lower nodes require GAAFET transistor design.
According to the Minister of Technology and Industry construction of the fab will start second half of this year. The fab will initially produce 110nm and later 65nm chips for EVs, household appliances, and renewable energy. This fab can theoretically produce chips as small as 28nm.
22nm production is probably related to phase 2 and another fab investment will be needed.
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